1-1612781-1

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1-1612781-1 datasheet

• Маркировка
  1-1612781-1
• Производитель
  TE Connectivity
• Описание
  TE Connectivity 1-1612781-1 Application Type: DDR SDRAM Body Orientation: Straight Boss: Without Center Key (mm [in]): None Centerline (mm [in]): 0.60 [0.024] Contact Base Material: Copper Alloy Contact Material: Copper Alloy Contact Plating: Gold Contact Plating, Mating Area, Material: Gold Flash Dram Type: Double Data Rate (DDR) Dram Voltage: 2.5 V Ejector Location: Both Ends Ejector Type: Locking Gender: SKT Housing Color: Black Housing Material: High Temperature Thermoplastic Insertion Style: Cam-In Insulation Material: Thermoplastic Keying: Standard Latch Material: Stainless Steel Latch Plating: Tin Lead Free Solder Processes: Reflow solder capable to 245?°C Module Orientation: Right Angle Mount Type: Printed Circuit Board Mounting Style: Surface Mount Number Of Contact Rows: 2 Number Of Contacts: 200POS Number Of Keys: 1 Number Of Positions: 200 Number Of Rows: Dual Packaging Method: Semi-Hard Tray Assembly Pcb Mount Style: Surface Mount Pitch (mm): 0.6mm Profile: Standard Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Converted to comply with RoHS directive Row Spacing (mm): 6.2mm Row-to-row Spacing (mm [in]): 6.20 [0.244] Socket Style: SO DIMM Socket Type: Memory Card Solder Tail Contact Plating: Gold Flash Stack Height (mm [in]): 5.60 [0.220] Type: SO DIMM Socket Ul Flammability Rating: UL 94V-0
• Количество страниц
  1 шт.
• Форматы файла
  HTML, PDF

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